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What is full bonding technology? Advantages of full fit

Full lamination (full lamination) is also called non-air-gap technology. Compared with traditional lamination methods, full lamination can clearly see the difference in the image reflected from the screen. This is the current mainstream development trend of high-end SMT chip processing, smart phones and tablet PC panels. The manufacturing process and components of the touch panel seem to be simple, but in fact the touch panel manufacturing process varies widely. In terms of technology, both the front-end and back-end processes are extremely variable and growing.

The full-plane lamination technology is to directly paste the panel on the outer glass (or touch panel) with glue. Since the middle is in a vacuum state, the problem of light refraction can be avoided. However, if it is laminated with traditional oral glue, it is very It is easy to see the double-image phenomenon like two pieces of glass. In addition, the full-surface lamination can make the screen more high-brightness and high-quality realism, even under strong outdoor light, you can still clearly see the screen display of SMT processed mobile phones or tablets.

Full-plane bonding will be an unstoppable trend, but the current challenge is that the difficulty of bonding is much higher than that of touch panel glass capacitor bonding, and the larger the size, the more difficult it is to fit. The prices of both the LCD panel and the touch panel are not low, and if they are damaged during the bonding process, the loss will be huge.

What is the full bonding technology? The competition of smartphones is becoming more and more fierce. Many manufacturers hope to highlight themselves through hardware differentiation. New terms such as IPS, SLCD, retina, and ClearBlack are constantly appearing. Many times when we have not yet understood the new technology New technical terms were born again. Recently, many mobile phone manufacturers have begun to use the technology of "full fit" to increase the selling point of their mobile phones? What exactly is this, let's take a look together.

The structure of the screen

From the structure of the screen, we can roughly divide the screen into three parts, from top to bottom are protective glass, touch screen, and display. These three parts need to be bonded. Generally speaking, two bonding is required, one bonding is performed between the protective glass and the touch screen, and the other bonding is between the display and the touch screen. According to the way of lamination, it can be divided into two types: full lamination and frame lamination.

Frame sticker

The so-called frame paste is also called word-adhesive bonding, that is, the touch screen and the four sides of the display are simply fixed with double-sided tape. This is also the bonding method adopted by most displays at present. Its advantages are simple process and low cost. , But because there is an air layer between the display screen and the touch screen, the display effect is greatly reduced after the light is refracted, which becomes the biggest shortcoming of the frame sticker.

Full fit

Full bonding means that the panel and the touch screen are completely bonded together in a seamless manner with water glue or optical glue. Compared with frame stickers, it can provide a better display effect.

Advantages of full fit

The full bonding technology eliminates the air between the screens, which helps reduce the reflection between the display panel and the glass, which can make the screen look more transparent and enhance the display effect of the screen. At present, some mobile phones like iPhone 4S, Mi 2, Nexus 7, and Ascend D1 quad-core have also adopted full-fit technology. In addition, Apple's latest iMac also uses a full-fit technology.

Another benefit of the full-fit technology is that the screen will never get dusty again. The touch module is also closely integrated with the panel to increase the strength. In addition, the full bonding can effectively reduce the interference of the display panel noise on the touch signal.

Although the advantage of full lamination is huge, the yield rate is relatively low. The consumption and scrap of surface glass and even the panel in the lamination process caused by poor yield will inevitably lead to an increase in cost, so deaeration and The control of the bonding yield will become a more important factor than the material cost.

Since the full bonding technology has significantly improved the display effect of the screen, it will definitely be a battleground for the next. And the investment of many manufacturers will also help reduce costs and accelerate the improvement of the yield rate. I believe that the full bonding technology will soon It is popularized in most of our mobile phones.



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